Real-time photoemission detection system
AssigneeAdvanced Micro Devices, Inc.
InventorBrennan V. Davis
Life of this patent
Estimating the term…
Abstract
Post-manufacturing analysis of a semiconductor chip is enhanced via a method and system for viewing emissions through substrate in the back side of the chip. According to an example embodiment of the present invention, a portion of circuitry in a semiconductor chip is excited, and an emission is generated. An optical microscope is directed at the backside of the chip, and an image of the emission is obtained. The optical microscope is coupled to an indium-gallium-arsenic (InGaAs) camera that is used to detect the emission. In this manner, emissions can be detected through substrate in a semiconductor chip.
Claims33
A method for analyzing a semiconductor chip having a back side opposite a circuit side, wherein the back side includes silicon substrate and the circuit side includes circuitry, the method comprising:
- providing an optical microscope arrangement that includes an InGaAs camera;
- exciting a portion of circuitry in the semiconductor chip;
- directing the optical microscope arrangement at the back side of the chip and obtaining an image;
- and
- using the InGaAs camera, detecting an emission from the semiconductor chip.
A system for analyzing a semiconductor chip having a back side opposite a circuit side, wherein the back side includes silicon substrate and the circuit side includes circuitry, the system comprising:
- means for exciting a portion of circuitry in the semiconductor chip;
- and
- means, including an InGaAs camera arrangement directed toward the back side of the chip, for obtaining an image and providing image data to the camera arrangement.
A system for analyzing a semiconductor chip having a back side opposite a circuit side, wherein the back side includes silicon substrate and the circuit side includes circuitry, the system comprising:
- an excitation arrangement adapted to excite a portion of the circuitry;
- and
- a microscope arrangement including an InGaAs camera arrangement directed toward the back side of the chip, and adapted to obtain an image and adapted to obtain the image data from the microscope arrangement.
Dependencies are inferred from the claim text.