US 6,724,791 B1 · Method and apparatus for controlling the temperature of a laser module in fiber optic transmissions

Abstract

A semiconductor laser diode for transmitting optical signals in a telecommunications network is housed within a module supported adjacent to a thermoelectric cooling element that is mounted in thermally conductive contact with a heat sink. The cooling element is positioned externally on the surface of the module. The adjacent surface areas of the module and the cooling element are brought into thermal conductivity by a thermally conductive filler occupying the space between the module and the cooling element. The filler conforms to the configuration of the adjacent surfaces of the module and the cooling element to increase the thermal conductivity therebetween for maximum efficiency in the transfer of heat from the laser diode through the module to the cooling element and the heat sink. In response to a change in the temperature of the laser diode, the current applied to the cooling element is adjusted to increase or decrease the current and accordingly sink heat from the laser diode or supply heat to the laser diode. By removing the cooling element from internally within the laser module, the manufacturing cost of the laser module is substantially reduced.

Claims20

Dependent claims

A laser diode assembly in a telecommunications network comprising:

a module of a preselected configuration housing the laser diode,
a thermoelectric cooling element having opposing surfaces, a first of said opposing surfaces being a controlled surface maintained at a selected operating temperature and a second of said opposing surfaces being an uncontrolled surface for transfer heat to and from said cooling element,
a heat sink positioned in thermal contact with said cooling element second surface,
said module having a heat transfer surface positioned oppositely of said cooling element first surface,
a thermally conductive material filling the space between said module heat transfer surface and said cooling element first surface,
said thermally conductive material having at least one surface conforming to said module heat transfer surface and to said cooling element first surface to place said module in thermal contact with said cooling element for transfer of heat therebetween, and
a measuring device mechanically supported by said conductive material for detecting a change in the temperature of said cooling element first surface from the operating temperature and adjusting the current applied to said cooling element to transfer heat between said module, said cooling element, and said heat sink to maintain said cooling element at the operating temperature.

4 more elements

A method for assembling a laser diode in a telecommunications network comprising the steps of:

housing a laser diode within a laser module having an outer surface fabricated of a thermally conductive material,
connecting the laser module to a telecommunications network for the transmission of optical signals thereto,
positioning a thermoelectric cooling element oppositely of the laser module for transfer of heat therebetween,
positioning the cooling element in thermal contact with a heat sink for transfer of heat between the cooling element and the heat sink,
inserting a thermally conductive material between and in contact with opposing surfaces of the laser module and the cooling element to place the laser module and the cooling element in thermal contact for the transfer of heat therebetween,
measuring the temperature of the cooling element to detect a change in the temperature of the laser module from a preselected temperature responsive to heat transferred from the laser module to the cooling element, and
adjusting the electric current applied to the cooling element to transfer heat between the laser module and the heat sink through the cooling element to maintain a preselected temperature of the laser module.

4 more elements

Apparatus for controlling the temperature of a semiconductor laser diode comprising:

a module housing the laser diode and positioned in thermal contact therewith,
said module including a thermally conductive surface having a preselected configuration,
a thermoelectric cooling element positioned in heat transfer relation with said module, said cooling element including a thermally conductive surface having a preselected configuration,
a heat sink positioned in thermal contact with said thermoelectric cooling element, and
a thermally conductive filler material positioned between said module and said cooling element in conformity with the configurations of said thermally conductive surfaces of said module and said cooling element to place said module and said cooling element in thermal contact for the transfer of heat between the laser diode and the heat sink, a temperature sensing element for monitoring the temperature of said cooling element, and said temperature sensing element secured to said thermally conductive material.

2 more elements

Dependencies are inferred from the claim text.

Method and apparatus for controlling the temperature of a laser module in fiber optic transmissions

Life of this patent

Method and apparatus for controlling the temperature of a laser module in fiber optic transmissions

Life of this patent

Abstract

Claims20