Heat sink assembly with adjustable clip

A method for securing a heat sink to a motherboard, the motherboard defining a plurality of through apertures, the method comprising the steps of:

• a) providing a back plate comprising a plurality of posts extending upwardly therefrom;
• b) providing a heat sink comprising a base and a plurality of fins arranged on the base, the base defining a plurality of through holes;
• c) providing a clip comprising a pressing portion and a pair of locking portions, each of the locking portions defining a large cutout and a small cutout;
• d) attaching the heat sink on the motherboard;
• e) attaching the back plate to an underside of the motherboard, with the posts extending through the through apertures and the through holes respectively;
• and
• f) placing the clip over top ends of the posts, with the posts protruding beyond the large cutouts respectively;
• g) pushing the clip horizontally until the posts engage in the small cutouts respectively;
• and
• h) screwing a bolt through the pressing portion of the clip to abut the base.

A heat sink assembly comprising:

• a board;
• an electronic device located on one side of the board without lateral movement;
• a heat sink seated upon the electronic device;
• a pair of rods each having a wide head and a narrow neck horizontally immoveable relative to the board;
• and
• a clip including a central portion and two locking portions at two elongated ends, each of said locking portions defining large and small sections to allow the wide head of the corresponding rods to extend through the large section in an initial relative vertical movement and engage the small section in a successive relative lengthwise movement;
• wherein
• an adjustable knob is provided on the central portion, which is able to increase a relative distance between the central portion and heat sink along an axial direction of the adjustable knob to have the clip and the heat sink in a tension manner for securing the heat sink to the board and assuring tight abutment between the heat sink and the electronic device.