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US 6,724,631 B2Granted
Power converter package with enhanced thermal management
AssigneeDelta Electronics, Inc.
InventorsRunqing Ye, Alpha J. Zhang
Life of this patent
Estimating the term…
Abstract
A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of symmetric leads. A heat spreader is directly attached onto the bare top heat-slug of the sub-packages, planar magnetic parts and top surfaces of other components with thermally conductive insulator. The heat dissipated by the sub-packages is transferred to the attached heat spreader by the bare top heat-slug, and further transferred to the ambient. The assembly features compact and inexpensive power converter package with improved electrical performance and enhanced thermal management.
Claims23
A package for a power converter, comprising:
- a multi-layer circuit board having a first electrically conductive surface and a second electrically conductive surface opposite to the first electrically conductive surface;
- a heat spreader having at least a heat transfer surface;
- and
- a sub-package including a bare top heat-slug, a power-dissipating chip mounted on a first surface of the bare top heat-slug, a plurality of symmetric leads fixedly connected to the bare top heat-slug, and bonding structures connected between the symmetric leads and the power-dissipating chip, wherein the sub-package is disposed between one of the electrically conductive surfaces of the multi-layer circuit board and the heat transfer surface of the heat spreader such that a second surface of the bare top heat slug is in contact with the heat transfer surface of the heat spreader through a thermally conductive insulator to provide a thermally conductive pathway therebetween, and the plurality of symmetric leads are in contact with a first surface of the electrically conductive surfaces of the multi-layer circuit board to provide an electrically conductive pathway therebetween,
- wherein the plurality of symmetric leads and the heat-slug are disposed in opposite orientations so that the electrically conductive pathway is separate from the thermally conductive pathway.
2 more elements
A method of packaging a power converter, comprising:
- providing a multi-layer circuit board having at least an electrically conductive surface;
- providing a heat spreader having at least a heat transfer surface;
- and
- disposing a sub-package between the electrically conductive surface of the multi-layer circuit board and the heat transfer surface of the heat spreader, the sub-package having a bare top heat-slug, a power-dissipating chip mounted on a first surface of the bare top heat-slug, a plurality of symmetric leads fixedly connected to the bare top heat-slug, and bonding structures connected between the symmetric leads and the power-dissipating chip, wherein the electrically conductive surface of the multi-layer circuit board is adapted to be electrically connected with the leads of the sub-package to provide an electrically conductive pathway therebetween the heat transfer surface of the heat spreader is adapted to be thermally connected with the heat-slug of the sub-package through a thermally conductive insulator to provide a thermally conductive pathway therebetween, and the electrically conductive pathway is separate from the thermally conductive pathway.
1 more element
A sub-package arranged in a package for a power converter, comprising:
- a power-dissipating chip;
- a bare top heat-slug having a first surface in contact with the power-dissipating chip and a second surface in contact with a heat spreader of the package to provide a thermally conductive pathway for heat transfer from the power-dissipating chip;
- a plurality of symmetric leads fixedly mounted on the first surface of the bare top heat-slug and to provide an electrically conductive pathway to a multi-layer circuit board of the package;
- and
- bonding structures electrically connected between the symmetric leads and the power dissipating chip for an interconnection, wherein the plurality of symmetric leads and the bare top heat-slug are disposed in opposite orientations so that an electrically conductive pathway is separate from a thermally conductive pathway.
2 more elements
A sub-package arranged in a package for a power converter, comprising:
- a discrete power-dissipating device;
- a bare top heat-slug having a first surface in contact with the discrete power-dissipating device and a second surface in contact with a heat spreader of the package to provide a thermally conductive pathway for heat transfer from the power-dissipating chip;
- a plurality of symmetric leads fixedly mounted on the first surface of the bare top heat-slug to provide an electrically conductive pathway to a multi-layer circuit board of the package;
- and
- a conductive trace electrically connected between the symmetric leads and the discrete power-dissipating device for an interconnection, wherein the plurality of symmetric leads and the bare top heat-slug are disposed in opposite orientations so that an electrically conductive pathway is separate from a thermally conductive pathway.
2 more elements
A sub-package arranged in a package for a power converter, comprising:
- a power-dissipating chip;
- a bare top heat slug having a first surface in contact with the power-dissipating chip and a second surface in contact with a heat spreader of the package to provide a thermally conductive pathway for heat transfer from the power-dissipating chip;
- a plurality or symmetric balls fixedly mounted on the first surface of the bare top heat-slug to provide an electrically conductive pathway to a multi-layer circuit board of the package;
- and
- bonding structures electrically connected between the symmetric balls and the power-dissipating chip for an interconnection, wherein the plurality of symmetric balls and the bare top heat-slug are disposed in opposite orientations so that an electrically conductive pathway is separate from a thermally conductive pathway.
2 more elements
A sub-package arranged in a package for a power converter, comprising:
- a discrete power-dissipating device;
- a bare top heat-slug having a first surface in contact with the discrete power-dissipating device and a second surface in contact with a heat spreader of the package to provide a thermally conductive pathway for heat transfer from the power-dissipating chip;
- a plurality of symmetric balls fixedly mounted on the first surface of the bare top heat-slug to provide an electrically conductive pathway to a multi-layer circuit board of the package, and
- a conductive trace electrically connected between the symmetric balls and the discrete power-dissipating device for an interconnection, wherein the plurality of symmetric balls and the bare top heat-slug are disposed in opposite orientations so that an electrically conductive pathway is separate from a thermally conductive pathway.
1 more element
Dependencies are inferred from the claim text.