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US 6,724,630 B2Granted
Stacked device assembly
AssigneeRenesas Technology Corp.
InventorsNobuhiro Kato, Masataka Kawai
Life of this patent
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Abstract
In order to progress a mounting consistency of electric devices on a substrate, an electronic device assembly, comprising a lower electronic device having electrodes in a surface opposed to the substrate and an upper electronic device having a plurality of the leads each extending from the side surface of own package toward the substrate.
Claims5
An electronic device assembly, comprising:
- a lower electronic device to be mounted on a substrate;
- and
- an upper electronic device to be provided on or above the lower electronic device,
- wherein the lower electronic device has a first package, the first package having a lower surface and an upper surface, the lower surface bears a plurality of electrodes so that the electrodes exist within a region defined by the lower surface, wherein the lower electronic device is mounted on the substrate so that the electrodes contact with the substrate;
- wherein the upper electronic device has a second package and a plurality of leads each extending from the second package toward the substrate, wherein the upper electronic device is provided on or above the lower electrodes while the leads contact with the substrate.
2 more elements
Dependencies are inferred from the claim text.