# US 6,724,625 B2 · Radiator mechanism and electronic apparatus having same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 6,724,625 B2
- Document ID: US6724625B2
- Status: Granted
- Kind: B2
- Application number: 10/077,857
- Filed: 2002-02-20
- Published: 2002-07-25
- Granted: 2004-04-20
- Earliest claimed: 2000-03-31
- Assignees: Fujitsu Limited
- Inventors: Koichi Inoue
- Web page: https://patentgrep.com/patent/US6724625B2

## CPC

- G06F 1/203: {for portable computers, e.g. for laptops}
- H05K 7/20172: {Fan mounting or fan specifications}
- H05K 1/0272: {Adaptations for fluid transport, e.g. channels, holes}
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic components, thermal deformation of a housing thereof, and low-temperature burn, without preventing the electronic apparatus including a printed board from miniaturization. The radiator mechanism is comprised of a cooling fan and a through hole provided in a motherboard, thereby thermally protecting a variety of circuit components mounted on the motherboard to provide a stable operation.

## Claims

### Claim 1

A radiator mechanism comprising:
a board, including a front surface and a back surface, on which an exoergic part is to be mounted, said board including a through hole; and
a heat pipe including a first portion disposed on the front surface and a second portion disposed on the back surface and connected to the first portion using the through hole,
wherein the first portion is connected to the exoergic part; and
wherein the first portion of the heat ripe runs parallel to the front surface and the second portion of the heat give runs parallel to the back surface.

### Claim 2 (depends on 1)

The radiator mechanism according to claim 1, further comprising a heat sink that comprises a cooling fin mounted on the front surface of the board and a cooling fan disposed above the through hole.

### Claim 3 (depends on 2)

The radiator mechanism according to claim 2, wherein the cooling fan rotates around an axis perpendicular to said front surface of said board, and absorbs air from said back surface of said board.

### Claim 4 (depends on 3)

The radiator mechanism according to claim 3, wherein the cooling fan exhausts the air in a direction parallel to said front surface of said board, whereby the air flows over said heat sink.

### Claim 5 (depends on 4)

The radiator mechanism according to claim 4, wherein the cooling fan and the heat sink are comprised in a fan-cum-heat sink unit.

### Claim 6 (depends on 4)

The radiator mechanism according to claim 4, wherein at least a portion of the heat pipe runs parallel to the front surface and to the back surface.