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US 6,724,574 B2Granted
Head gimbal assembly having an encased drive IC chip
AssigneeTDK Corporation
InventorsTakeshi Wada, Mitsuyoshi Kawai, Takao Matsumoto, Atsushi Hirose, Masashi Shiraishi
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Abstract
A HGA includes a magnetic head slider having at least one thin-film magnetic head element, an IC chip having a circuit for the at least one thin-film magnetic head element, and a suspension for supporting the magnetic head slider and the IC chip. All surfaces of the IC chip are coated by additional insulation layers.
Claims10
A head gimbal assembly comprising:
- a magnetic head slider having at least one thin-film magnetic head element;
- an IC chip having a circuit for said at least one thin-film magnetic head element;
- and
- a suspension for supporting said magnetic head slider and said IC chip,
- all surfaces of said IC chip being coated by additional insulation layers to form an underfill layer filled in a clearance between said IC chip and said suspension, and an insulation coating layer for covering a top surface and side surfaces of said IC chip, said underfill layer and said insulation coating layer being formed by the same insulation material.
2 more elements
A head gimbal assembly comprising:
- a magnetic head slider having at least one thin-film magnetic head element;
- an IC chip having a circuit for said at least one thin-film magnetic head element;
- and
- a suspension for supporting said magnetic head slider and said IC chip,
- all surfaces of said IC chip being coated by additional insulation layers made of a mixture of a resin material and an insulation material with high heat conductivity.
2 more elements
Dependencies are inferred from the claim text.