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US 6,724,448 B2Granted
Liquid crystal display device and manufacturing method by compression bonding
AssigneeSeiko Epson Corporation
InventorHiroki Nakahara
Life of this patent
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Abstract
When transparent substrates 110 and 120 are compression-bonded via a sealing member 130, conductive particles 132 formed to be slightly larger break through relatively soft alignment layers 113 and 123 to become in contact with both inner end portions 111c and outer end portions 121c, and in this state, the sealing member 130 is cured.
Claims4
A manufacturing method for a liquid crystal device comprising:
- attaching a first substrate and a second substrate to each other with a liquid crystal sealed in therebetween so that a projecting portion of the first substrate projects outward beyond an outer edge of the second substrate;
- forming a first conductive member on a surface of the first substrate;
- forming a second conductive member on a portion of the second substrate that opposes the first conductive member;
- forming an alignment layer having a thickness of 100 to 400 angstroms to cover a surface of the projecting portion as well as a surface of the first conductive member and the second conductive member;
- using compression bonding to conductively connect the first conductive member and the second conductive member in a vertical conducting portion with a conductive material containing conductive particles and non-conductive spacers, the conductive particles having an outside diameter that is 5 to 20% larger than an outside diameter of the non-conductive spacers, the compression bonding causing the conductive particles to break through the alignment layer to conductively contact the first conductive member and the second conductive member;
- and
- removing the alignment layer on the surface of the projecting portion after the compression bonding.
4 more elements
Dependencies are inferred from the claim text.