# US 6,724,295 B2 · Chip resistor with upper electrode having nonuniform thickness and method of making the resistor

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- Number: US 6,724,295 B2
- Document ID: US6724295B2
- Status: Granted
- Kind: B2
- Application number: 10/092,257
- Filed: 2002-03-07
- Published: 2002-09-19
- Granted: 2004-04-20
- Earliest claimed: 2001-03-09
- Assignees: Rohm Co., Ltd.
- Inventors: Torayuki Tsukada
- Web page: https://patentgrep.com/patent/US6724295B2

## CPC

- H01C 17/006: {adapted for manufacturing resistor chips}
- H01C 1/148: the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence)
- H01C 7/003: {Thick film resistors}
- H01C 17/281: {by thick film techniques}
- H01C: RESISTORS

## Abstract

A method of making a chip resistor is provided. According to this method, an aggregate board is first prepared which includes a first region and a second region which are spaced from each other via an excess portion. Then, a conductor pattern is formed which extends to bridge the first region and the second region. Subsequently, a resistor element is formed in each of the first region and the second region for connection to the conductor pattern. Then, the aggregate board is cut at the excess portion. The conductor pattern includes a thinner-walled portion extending across the excess portion and a thicker-walled portion connected to the thinner-walled portion and spaced from the excess portion.

## Claims

### Claim 1

A chip resistor comprising:
an insulating substrate having an upper surface and a side surface;
a first conductor pattern formed on the upper surface;
a resistor element connected to the first conductor pattern; and
a protective coating covering the resistor element;
the first conductor pattern including a thinner-walled portion contacting the upper surface, and a thicker-walled portion connected to the thinner-walled portion and contacting the upper surface, the thinner-walled portion being spaced from the resistor element and extending up to the side surface, the thicker-walled portion contacting the resistor element and being spaced from the side surface;
the thinner-walled portion being positioned entirely outside the protective coating;
the thicker-walled portion being positioned partially outside the protective coating and partially inside the protective coating.

### Claim 2

A chip resistor comprising:
an insulating substrate having an upper surface and a side surface;
a first conductor pattern formed on the upper surface;
a resistor element connected to the first conductor pattern; and
a second conductor pattern extending on the first conductor pattern;
the first conductor pattern including a thinner-walled portion contacting the upper surface, and a thicker-walled portion connected to the thinner-walled portion and contacting the upper surface, the thinner-walled portion being spaced from the resistor element and extending up to the side surface, the thicker-walled portion contacting the resistor element and being spaced from the side surface;
the second conductor pattern contacting both of the thinner-walled portion and the thicker-walled portion.

### Claim 3

A chip resistor comprising:
an insulating substrate having an upper surface and a side surface;
a first conductor pattern formed on the upper surface; and
a resistor element connected to the first conductor pattern;
the first conductor pattern including a thinner-walled portion contacting the upper surface, and a thicker-walled portion connected to the thinner-walled portion and contacting the upper surface, the thinner-walled portion being spaced from the resistor element and extending up to the side surface, the thicker-walled portion contacting the resistor element and being spaced from the side surface;
wherein the thinner-walled portion has a thickness of 0.1-3.0 μm, whereas the thicker-walled portion has a thickness of 5-25 μm.