Nonreciprocal circuit device and communication apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorTakashi Hasegawa
Life of this patent
Estimating the term…
Abstract
A nonreciprocal circuit device includes a resin case, and external terminals insert-molded with the resin case when the resin case is molded, so as to project from the resin case. The resin case is provided with concavities each formed in a bottom face of the resin case and enclosing a position at which each external terminal projects. During insert molding, any excess resin is absorbed by the concavities, whereby the resin is prevented from being applied to bottom faces of the external terminals.
Claims15
A nonreciprocal circuit device comprising:
- a resin case;
- and
- external terminals insert-molded with the resin case so as to project from a bottom face of the resin case when the resin case is molded;
- wherein
- the resin case is provided with at least one concavity, each concavity corresponding to a respective one of said external terminals and formed in the bottom face of the resin case at a position from which the corresponding external terminal projects;
- and
- the at least one concavity provides a space between the bottom surface of the resin case and the external terminals.
A nonreciprocal circuit device comprising:
- a resin case;
- and
- external terminals which are formed from connecting parts of a lead frame insert-molded with the resin case when the resin case is molded,
- a notch being formed in each of the connecting parts adjacent to a bottom face of the resin case;
- wherein the resin case is provided with at least one concavity each corresponding to a respective one of said external terminals and formed in the bottom face of the resin case at the position of the corresponding one of said notches.
A method of manufacturing a nonreciprocal circuit device comprising the steps of:
- insert-molding external terminals with a resin case so that the external terminals project from a bottom face of the resin case when the resin case is molded, and
- providing the resin case with concavities, each concavity corresponding to a respective one of said external terminals and formed in the bottom face of the resin case at a position from which the corresponding external terminal projects;
- and
- the concavities provide a space between the bottom surface of the resin case and the external terminals.
A method of manufacturing a nonreciprocal circuit device comprising the steps of:
- insert-molding resin ease with connecting parts of a lead frame to form external terminals in the resin case when the resin case is molded,
- a notch being formed in each of the connecting parts adjacent to a bottom face of the resin case, and
- providing the resin case with concavities, each corresponding to a respective one of said external terminals and formed in the bottom face of the resin case at the position of the corresponding one of said notches.
Dependencies are inferred from the claim text.