Semiconductor integrated circuit for multi-chip package with means to optimize internal drive capacity
AssigneeRenesas Technology Corp.
InventorsTakekazu Yamashita, Makoto Hatakenaka, Manabu Miura
Life of this patent
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Abstract
A semiconductor integrated circuit can variably set the driving power of all or part of internal input/output terminals and internal output terminals used within a multi-chip package. It can increase the driving power at an individual wafer test before packaging to sufficiently drive a load connected between a tester and the internal input/output terminals and internal output terminals, and can reduce the driving power after packaging. It can prevent noise and power consumption from being increased.
Claims12
A semiconductor integrated circuit used for a multi-chip package including a plurality of semiconductor integrated circuits, said semiconductor integrated circuit comprising:
- at least one internal output terminal, each of which includes a driver and is used for exchanging a signal with another semiconductor integrated circuit in said multi-chip package;
- and
- driving power variably setting means for variably setting driving power of the driver.
A multi-chip package including a plurality of semiconductor integrated circuits, at least one of said plurality of semiconductor integrated circuits comprising:
- at least one internal output terminal, each of which includes a driver and is used for exchanging a signal with another semiconductor integrated circuit in said multi-chip package;
- driving power variably setting means for variably setting driving power of the driver;
- a driving power control pad for transferring a control signal to said driving power variably setting means;
- and
- an external terminal connected to said driving power control pad and for transferring the input control signal to said driving power control pad.
Dependencies are inferred from the claim text.