Test board for testing semiconductor device
AssigneeRenesas Technology Corp.
InventorsDaisuke Ito, Hiroshi Nakagawa, Katsutoshi Ito, Naoyuki Shinonaga, Shinji Senba
Life of this patent
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Abstract
There is provided a test board for testing semiconductor devices by connecting a plurality of DUTs (semiconductor devices under the test) with a test head, and transmitting test signals from the test head to the plurality of DUTs. The test board comprises a motherboard connected to the test head; a multi-layer wiring board connected to each of the plurality of DUTs; and a scramble board disposed between the motherboard and the multi-layer wiring board. The motherboard and the scramble board, and the multi-layer wiring board and the scramble board are each connected by female connectors and male connectors.
Claims5
A test board for testing semiconductor devices by connecting a plurality of semiconductor devices under the test with a semiconductor test apparatus, and sending test signals from said semiconductor test apparatus to said plurality of semiconductor devices under the test, said test board comprising:
- a first wiring board disposed on said semiconductor test apparatus, and connected to said semiconductor test apparatus;
- a second wiring board connected to each of said plurality of semiconductor devices under the test through contact portions;
- and
- a third wiring board disposed between said first wiring board and said second wiring board, wherein
- said first wiring board and said third wiring board, and said second wiring board and said third wiring board are each connected by connectors,
- said plurality of semiconductor devices under the test are disposed on a lead frame.
- said test board is connected to said plurality of semiconductor devices under the test disposed on said lead frame, and
- a plurality of said lead frames are connected in the long side direction, and said test signals are transmitted synchronizing the conveyance of said lead frames.
A test board for testing semiconductor devices by connecting a plurality of semiconductor devices under the test with a semiconductor test apparatus, and sending test signals from said semiconductor test apparatus to said plurality of semiconductor devices under the test, said test board comprising:
- a first wiring board disposed on said semiconductor test apparatus, and connected to said semiconductor test apparatus;
- a second wiring board connected to each of said plurality of semiconductor devices under the test through contact portions;
- and
- a third wiring board disposed between said first wiring board and said second wiring board, wherein
- said first wiring board and said third wiring board, and said second wiring board and said third wiring board are each connected by connectors,
- said plurality of semiconductor devices under the test are disposed on a lead frame,
- said test board is connected in said plurality of semiconductor devices under the test disposed on said lead frame, and
- said third wiring board comprises a plurality of circuits corresponding to different array patterns of said plurality of semiconductor devices under the test on said lead frames.
Dependencies are inferred from the claim text.