Probe pin for testing electrical characteristics of apparatus, probe card using probe pins
AssigneeKabushiki Kaisha Toshiba
InventorsNoriaki Matsunaga, Hideki Shibata, Nobuo Hayasaka
Life of this patent
Estimating the term…
Abstract
A probe pin for testing electric characteristics of a semiconductor device comprises a silicon pin core (3, 23, 33), and a conductive film (4, 24, 34) covering the entire surface, including the bottom face, of the pin core. The bottom face of the probe pin is connected directly to an electrode (7, 37) positioned in or on a print wiring board. A number of probe pins can be connected to the associated electrodes at a high density, thereby forming a fine-pitch probe card having a superior high-frequency signal characteristic.
Claims16
A probe assembly, comprising:
- a probe pin for testing electrical characteristics of an apparatus, the probe pin comprising a silicon pin core and a single conductive layer on an entire surface of the silicon pin core, the probe pin having a tip and a bottom;
- and
- an electrode positioned below and connected to the bottom of the probe pin,
- wherein the silicon pin core of the probe pin has a metal silicide film at a bottom thereof.
A probe card, comprising:
- one or more probe pins for testing electric characteristics of an apparatus, each probe pin comprising a silicon pin core and a single conductive layer on an entire surface of the silicon pin core, each probe pin having a tip and a bottom;
- and
- a print wiring board having one or more electrodes, each electrode positioned below and connected to the bottom of a corresponding probe pin, wherein the silicon pin core has a metal silicide at a bottom thereof.
A probe pin for testing electric characteristics of an apparatus, comprising:
- a silicon pin core having a tip, a side, and a bottom;
- and
- a single conductive layer on the tip, the side, and the bottom of the silicon pin core, wherein the silicon pin core has a metal silicide film at the bottom.
Dependencies are inferred from the claim text.