Device carrier and autohandler

In an IC handling unit comprising an IC socket having socket contacts provided thereon, and a device carrier which receives and supports an IC device thereon, said IC device having IC terminals on a terminal face thereof at multiple positions wherein said device carrier and said IC socket are relatively movable toward and away from each other to allow the IC terminals to be brought into contact with said socket contacts in response to said relative movement of said device carrier and said IC socket toward each other, comprising the improvement wherein said device carrier comprises an opening formed therein in which said IC device is receivable, a support part disposed proximate said opening to at least partially close said opening such that said support part supports said device carrier within said opening and prevents passage of said IC device therethrough, and a hinge arrangement which turnably supports said support part on said device carrier to permit said support part to be pivotable from a first position wherein said opening is at least partially closed and a second position wherein said opening is opened to permit movement of said IC device toward said IC socket, said support part being turned in response to relative movement of said device carrier and said IC socket toward each other to release said IC device and permit movement of said IC device;toward said socket contacts and permit contact of said IC terminals with said socket contacts.

In an IC handling unit comprising an IC socket having socket contacts provided thereon, and a device carrier which receives and supports an IC device thereon, said IC device having IC terminals on a terminal face thereof at multiple positions wherein said device carrier and said IC socket are relatively movable toward and away from each other to allow the IC terminals to be brought into contact with said socket contacts in response to said relative movement of said device carrier and said IC socket toward each other, comprising the improvement wherein said carrier device comprises an opening into which said IC device is received, one or more support members hingedly connected to said carrier device proximate said opening by a hinge arrangement, said support members being movable between first and second positions, each of said support members including a support section projecting into said opening when said support member is in said first position to at least partially close said opening and support said IC device thereon, and further including engagement portions which are adapted to be contacted by said IC socket and moved to effect pivoting of said support members to said second position as said device carrier and said IC socket are moved toward each other, said support portions being disposed out of said opening when said support members are in said second position to permit downward displacement of said IC device such that said IC terminals contact said socket contacts.