Full wafer test configuration using memory metals
AssigneeInternational Business Machines Corporation
InventorsLewis S. Goldmann, Chandrika Prasad
Life of this patent
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Abstract
A semi-conductor wafer test or burn-in apparatus having spring contacts made from a shape memory metal which plastically deforms under normal test loading and has a transition temperature at or above or at or below the burn-in temperature.
Claims22
A spring contact for temporary attachment of a semi-conductor wafer to a test and/or burn-in apparatus, said spring fabricated from one of a shape memory metal, said shape memory metal plastically deforming under normal test or burn-in contact loading and having a transition temperature at or above the burn-in temperature, or said shape memory metal in combination with another metal.
A spring contact for temporary attachment of a microelectronic test or burn-in device being one of a shape memory metal plastically deforming under normal test or burn-in contact loading and having a transition temperature at or above the burn-in temperature, or said shape memory metal in combination with another metal.
A spring contact for temporary attachment of a semi-conductor wafer test and/or burn-in apparatus, said spring contact fabricated from one of a shape memory metal said shape memory metal plastically deforming under normal test or burn-in contact loading and having a transition temperature at or below the burn-in temperature, or said shape memory metal in combination with another spring metal.
A spring contact for temporary attachment of a microelectronic test or burn-in device being one of a shape memory metal plastically deforming under normal test or burn-in contact loading and having a transition temperature at or below the burn-in temperature, or said shape memory metal in combination with another metal.
A spring contact for temporary attachment of a microelectronic test or burn-in device being one of a shape memory metal which plastically deforms during cool-down after burn-in, said shape memory metal having a transition temperature at or below the burn-in temperature, or said memory metal in combination with another metal.
A method of improving a semi-conductor wafer test and/or burn-in apparatus utilizing temporary attachment with spring contacts by the step of:
- replacing said spring contacts with one of a spring contact fabricated from a shape memory metal or a shape memory metal spring in combination with a spring made from a standard spring metal, wherein said shape memory metal is one of;
- a shape memory metal that plastically deforms under test or burn-in conditions and has a transition temperature at or above the burn-in temperature, or a shape memory metal that plastically deforms under test or burn-in conditions and has a transition temperature at or below the burn-in temperature.
Dependencies are inferred from the claim text.