Glass and glass tube for encapsulating semiconductors
AssigneeNippon Electric Glass Co., Ltd.
InventorHiroyuki Kosokabe
Life of this patent
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Abstract
Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106 dPa·s, the temperature of said glass is not higher than 710° C., and includes two or more of Li2O, Na2O and K2O and B2O3. Also, the glass may comprise: SiO2, B2O3 and Al2O3 in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight.
Claims7
An encapsulator, for encapsulating a semiconductor, wherein the encapsulator is in the form of a tube and capable of hermetically encapsulating the semiconductor which is clamped by an electrode material in the tube,
- wherein said encapsulator is free of lead,
- wherein, when said encapsulator has a viscosity of 106 dPa s, the temperature of said encapsulator is not higher than 710° C., and
- wherein said encapsulator is a glass tube made of SiO2—B2O3—Al2O3 glass comprising:
- SiO2 in an amount of from 40 to 70% by weight:
- B2O3;
- Al2O3;
- and
- at least two of Li2O, Na2P and K2O in a total amount of from 10 to 25% by weight.
Dependencies are inferred from the claim text.