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US 6,724,091 B1Granted
Flip-chip system and method of making same
AssigneeIntel Corporation
InventorsSaikumar Jayaraman, Vijay S. Wakharkar
Life of this patent
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Abstract
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.
Claims24
A packaging system comprising:
- a flip-chip on a mounting substrate;
- an underfill mixture between the flip-chip and the mounting substrate, wherein the underfill mixture includes a principal underfill composition selected from silesquioxanes, thermosetting liquid crystal monomers, and combinations thereof.
A chip package comprising:
- a chip including an active surface;
- a mounting substrate including an upper surface that faces the active surface;
- electrical coupling between the active surface and upper surface;
- and
- an underfill mixture between the upper surface and the active surface, wherein the underfill mixture includes a principal underfill composition selected from silesquioxanes, thermosetting liquid crystal monomers, and combinations thereof;
- and
- wherein the underfill mixture includes at least one property selected from about 12.5 KSI tensile strength, a coefficient of thermal expansion less than about 60 ppm/° C., and a glass transition temperature greater than about 300° C.
4 more elements
Dependencies are inferred from the claim text.