Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device

A semiconductor chip which is to be bonded to a surface of a solid device via a connection member for electrical connection between an internal circuit thereof and the solid device, the semiconductor chip comprising:

• a low impedance portion disposed on the semiconductor chip;
• and
• a dummy bump provided on a surface of the semiconductor chip opposed to the surface of the solid device and not serving for electrical connection between the internal circuit of the semiconductor chip and the solid device, the dummy bump provided in a scribe line region of the semiconductor chip and electrically connected to the low impedance portion of the semiconductor chip;
• wherein the dummy bump has a height determined on the basis of a distance defined between the surface of the solid device and the surface of the semiconductor chip by the connection members.

A semiconductor device, comprising:

• a solid device;
• a semiconductor chip mounted and bonded onto a surface of the solid device;
• a functional bump for electrical connection between an internal circuit of the semiconductor chip and the solid device;
• and
• a dummy bump not serving for electrical connection between the internal circuit and the solid device wherein at least one of the solid device and the semiconductor chip includes a low impedance portion and the dummy bump is electrically connected to the low impedance portion, the dummy bump provided in a scribe line region of the semiconductor chip.