Method of producing semiconductor packages by cutting via holes into half when separating substrate

Abstract

A semiconductor package production method in which the semiconductor package is produced by having via holes for electrically connecting top and bottom surfaces of a double-sided copper clad substrate and cutting the substrate. The production method includes the steps of: forming wiring patterns between the top and bottom surfaces of the double-sided copper clad substrate; forming via holes each connecting the top and bottom surfaces of the substrate; attaching semiconductor chips on the wiring patterns; sealing an entire body of the substrate with resin; and cutting the substrate on a line which separates the via hole into half, thereby separating the semiconductor packages from one another. Each via hole has an oval shape in top view which is created by forming two or more circular holes partially overlapped with one another on a horizontal surface of the substrate.

Dependencies are inferred from the claim text.