US 6,724,081 B2 · Electronic assembly

Abstract

A replaceable integrated circuit device which replaces the connecting socket, the interposer and the pins in prior art with plural solder balls on the bottom of the integrated circuit package contacting and connecting the corresponding contact pad on the circuit board for electrical conduction. The contacting surface of the solder balls and the corresponding contact pad can be made as plane or as curve as possible to increase the contacting area. More over, there are many buckling apparatus placed on the circuit board to buckle the integrated circuit package and the circuit board firmly and to provide the extra downward force to make the solder balls and the corresponding contact pad contact and connect each other tightly. In the present invention, for the solder balls contacting the contact pads of the circuit board directly, which reduce the space that a connecting socket used in prior art and improve the usage ratio of the layout on a circuit board.

Claims8

Dependent claims

An electronic assembly for housing an integrated circuit package comprising:

a circuit board having a plurality of contact pads on one side, said contact pads being exposed and arranged as a plane contact area to contact and connect electrically to said integrated circuit package;
a buckle apparatus placed on the circuit board at a location around said plane contact area to form an open area for holding the integrated circuit package, wherein, when said integrated circuit package contacts said plane contact area, said buckle apparatus provides a buckling function to assure that said integrated circuit package is fixed on the circuit board correctly;
wherein said buckle apparatus comprises at least one buckle component which is placed on an extension area of said contact area, said buckle component having the following which are all made from one piece;
a base which is fired to, and extends inside, the circuit board;
a body having a first end and a second end the first end being a vertical extension of the base;
and
a hook provided on the second end of the body and which extends toward the contact area.

4 more elements

An electronic assembly, comprising:

an integrated circuit package which comprises an integrated circuit chip and a substrate with electrical circuit layout, some solder balls being placed on said substrate, said solder balls connecting electrically to said integrated circuit chip via said electrical circuit layout;
a circuit board having a plurality of contact pads formed on one side thereof, said contact pads being exposed and directly contacting some corresponding solder balls of said integrated circuit package such that there are no intermediate elements between each set of contacting contact pad and solder ball;
a buckle apparatus placed on circuit board and on a location around said contact pads to form a frame-shaped open area for holding the integrated circuit package, with the size of said open area being about equivalent to the size of the substrate, wherein said buckle apparatus provides a buckling function to said substrate to assure that said solder balls and said contact pads are connected correctly.

Dependencies are inferred from the claim text.

Electronic assembly

Life of this patent

Electronic assembly

Life of this patent

Abstract

Claims8