Electronic assembly comprising solderable thermal interface

An integrated circuit package comprising:

• a substrate;
• a die positioned on a surface of the substrate, the die having a back surface;
• an adhesion layer of metal formed on the back surface;
• a solder-wettable layer formed on the adhesion layer;
• a lid positioned over the die;
• and
• a solderable thermally conductive element coupling the solder-wettable layer and the lid.

An electronic assembly comprising:

• at least one integrated circuit package comprising:
• a substrate;
• a die positioned on a surface of the substrate, the die having a back surface
• an adhesion layer of metal formed on the back surface;
• a solder-wettable layer formed on the adhesion layer;
• a lid positioned over the die;
• and
• a solderable thermally conductive element coupling the solder-wettable layer and the lid.

An electronic system comprising an electronic assembly having at least one integrated circuit package comprising:

• a substrate;
• a die positioned on a surface of the substrate, the die having a back surface;
• an adhesion layer of metal formed on the back surface;
• a solder-wettable layer formed on the adhesion layer,
• a lid positioned over the die;
• and
• a solderable thermally conductive element coupling the solder-wettable layer and the lid.

An assembly comprising:

• a die having a surface;
• an adhesion layer of metal formed on the surface;
• and
• a solder-wettable layer formed on the adhesion layer to receive a solderable thermally conductive element.

An assembly comprising:

• a die having a surface;
• an adhesion layer of metal coupled to the surface;
• a solder-wettable layer coupled to the adhesion layer;
• a lid;
• and
• a thermal interface of solder material to couple the lid to the solder-wettable layer.