# US 6,724,076 B1 · Package for a semiconductor chip

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 6,724,076 B1
- Document ID: US6724076B1
- Status: Granted
- Kind: B1
- Application number: 10/111,294
- Filed: 2003-06-26
- Granted: 2004-04-20
- Earliest claimed: 1999-11-15
- Assignees: Infineon Technologies AG
- Inventors: Knut Kahlisch; Volker Strutz
- Web page: https://patentgrep.com/patent/US6724076B1

## CPC

- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 70/68: Shapes or dispositions thereof
- H10W 70/688: {Flexible insulating substrates}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The invention relates to a packaging for a semiconductor chip. A frame that directly surrounds the slot is provide on the carrier board on the side of the nubbins. Said frame is provided with the same height as the nubbins and the slot and the frame surrounding said slot are at least partially filled with a casting compound which is preferably adapted to the thermal expansion coefficients of the semiconductor chip.

## Claims

### Claim 1

A package for a semiconductor chip, in particular for CSP, μBGA or FBGA packages, with a carrier board made of polyimide, the carrier board having a central slot and being provided on one side with interconnects and a micro-ball grid array and on the other side, next to the slot, with a plurality of rows of nubbins for receiving the semiconductor chip by die bonding, and in which the bonding pads are arranged in a linear central manner on the semiconductor chip and are connected to the interconnects on the carrier board via contact bridges passed through the slot, characterized in that provided on the carrier board (1), on the side of the nubbins (8), is a frame (9) which directly surrounds the slot (5), is of the same height as the nubbins (8) and has, at least on the chip side, an adhesive bonding edge, and in that the slot (5) and the frame (9) surrounding the latter are at least partially filled with a casting compound.

### Claim 2 (depends on 1)

The package as claimed in claim 1, characterized in that the frame (9) is adhesively bonded to the carrier board (1).

### Claim 3 (depends on 1)

The package as claimed in claim 1, characterized in that the frame (9) is printed onto the carrier board in the same way as the nubbins (8).

### Claim 4 (depends on 1)

The package as claimed in claim 1, characterized in that the casting compound consists of silicone.

### Claim 5 (depends on 4)

The package as claimed in claim 4, characterized in that the coefficient of thermal expansion of the casting compound is adapted to the coefficient of thermal expansion of the semiconductor chip (10).

### Claim 6 (depends on 5)

The package as claimed in claim 5, characterized in that the casting compound contains a high proportion of Si particles.

### Claim 7 (depends on 1)

The package as claimed in claim 1 characterized in that the casting compound is formed as a glob top.

### Claim 8 (depends on 1)

The package as claimed in claim 1, characterized in that the filing height of the casting compound is the bonding channel, which forced after die bonding and is bounded by slot and the frame on the one hand any the bonded semiconductor chip on the other hand, is chosen to be high enough that at least the contact bridges are completely enclosed by the casting compound.

### Claim 9 (depends on 8)

The package as claimed in claim 8, characterized in that the filling height of the casting compound is determined by prescribing the filling amount during dispensing.