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US 6,724,073 B2Granted
Plastic lead frames for semiconductor devices and packages including same
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Jerrold L. King
Life of this patent
Estimating the term…
Abstract
A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
Claims22
A lead frame for an integrated circuit package comprising:
- a conductive plastic lead frame structure having a conductive coating over at least portions of said conductive plastic lead frame structure, said conductive coating including an intrinsic conductive polymer;
- and
- an adhesive located on a portion of said conductive plastic lead frame structure.
An electronic device comprising:
- at least one integrated circuit die having at least one bond pad;
- a conductive plastic lead frame having at least one conductive plastic lead finger;
- an adhesive for attaching said at least one integrated circuit die to a portion of said conductive plastic lead frame;
- at least one connector for connecting said at least one bond pad of said at least one integrated circuit die to said at least one conductive plastic lead finger of said conductive plastic lead frame;
- and
- material for encapsulating at least a portion of said integrated circuit die and at least a portion of said at least one conductive plastic finger of said conductive plastic lead frame.
3 more elements
Dependencies are inferred from the claim text.