Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same
AssigneeSanyo Electric Co., Ltd.
InventorsIsao Ochiai, Kazumi Onda
Life of this patent
Estimating the term…
Abstract
The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.
Claims21
A lead frame, comprising:
- at least one island;
- a pair of first connected line bodies and a pair of second connected line bodies which are disposed so as to surround said island;
- a plurality of leads extending from said first and second connected line bodies to the vicinity of the island;
- tie bars which integrate said leads and are disposed so as to surround the island;
- and
- air vent disposing regions formed in the vicinities of regions in which the first and second connected line bodies intersect;
- wherein at least in a first of said air vent disposing regions, a first air vent penetrating a lead forming region between said first air vent disposing region and the island and a second air vent that is formed independently in the vicinity of this first air vent are provided.
A method for manufacturing a semiconductor device, comprising:
- preparing a lead frame having at least tie bars for integrally supporting a plurality or leads and first air vents and second air vents, and on which semiconductor elements are mounted;
- housing said lead frame in a resin sealing mold that includes an upper mold and a lower mold and has a substantially hexahedral cavity and four corners of said hexahedron formed at a surface of contact between the upper mold and lower mold via the lead frame, and air releasing grooves at the contact surfaces of at least the upper mold or lower mold from a plurality of said corners;
- and
- leading air in the cavity through the first air vents, the air releasing grooves and the second air vents, and filling a resin in the cavity, whereby a resin sealed body is formed.
Dependencies are inferred from the claim text.