Semiconductor device with reduced short circuiting between gate electrode and source/drain region
AssigneeSanyo Electric Co., Ltd.
InventorsYoshikazu Ibara, Yoshio Okayama
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AssigneeSanyo Electric Co., Ltd.
InventorsYoshikazu Ibara, Yoshio Okayama
Estimating the term…
A semiconductor device capable of effectively preventing defective short-circuiting across a gate electrode and an impurity region and reducing the resistance of the gate electrode and the impurity region is provided. In this semiconductor device, a first gate film is formed on a channel region through a gate insulator film. A second gate film consisting of a first compound layer is formed on the first gate film. A second compound layer is formed on the surface of the impurity region. A reaction preventing film for preventing the first compound layer and the second compound layer from reacting with each other is formed on the second gate film. The first and second compound layers are formed independently of each other without reaction in the process of formation due to the reaction preventing film. Thus, defective short-circuiting across the gate electrode and the impurity region is effectively prevented while process tolerance is increased.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.