# US 6,724,054 B1 · Self-aligned contact formation using double SiN spacers

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- Number: US 6,724,054 B1
- Document ID: US6724054B1
- Status: Granted
- Kind: B1
- Application number: 10/320,867
- Filed: 2002-12-17
- Granted: 2004-04-20
- Earliest claimed: 2002-12-17
- Assignees: Infineon Technologies AG
- Inventors: Woo-tag Kang; Rajeev Malik; Mihel Seitz
- Web page: https://patentgrep.com/patent/US6724054B1

## CPC

- H10W 20/069: {by forming self-aligned vias or self-aligned contact plugs}
- H10D 64/021: {using multiple gate spacer layers, e.g. bilayered sidewall spacers}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

A method for fabricating a self-aligned contact in an integrated circuit includes defining first spacer layers over the sidewalls of a pair of wordline stacks. An oxide layer is deposited over the tops of the wordline stacks, the first spacer layers and a surface of the substrate disposed between the first spacer layers. The oxide layer is removed from the first spacer layers, thereby forming a remaining oxide layer that covers the surface of the substrate disposed between the first spacer layers. Second spacer layers are formed over the first spacer layers, and which cover respective portions of the remaining oxide layer. The remaining oxide layer is removed to thereby form undercut regions. The undercut regions are substantially filled with contact material during formation of the contact.

## Claims

### Claim 1

A self-aligned contact structure in an integrated circuit, the integrated circuit having a substrate and at least one wordline stack formed thereon, the wordline stack having sidewalls, said self-aligned contact structure comprising:
a first spacer layer of insulative material disposed upon said sidewalls and overlying a portion of the substrate;
a second spacer layer of insulative material disposed upon said first spacer layer and over said sidewalls, said second spacer layer being spaced a predetermined distance from said substrate, undercut regions defined by said first and second spacer layers and the substrate; and
contact material disposed upon the substrate and said second spacer layers, said contact material substantially completely filling in said undercut regions.

### Claim 2 (depends on 1)

The self-aligned contact structure of claim 1, wherein said first and second spacer layers comprise silicon nitride.

### Claim 3 (depends on 2)

The self-aligned contact structure of claim 2, wherein said first and second spacer layers have an average thickness of from approximately 200 to approximately 1000 Angstroms (Δ).

### Claim 4 (depends on 3)

The self-aligned contact structure of claim 3, wherein said first and second spacer layers have an average thickness of from approximately 200 to approximately 600 Angstroms (Δ).

### Claim 5 (depends on 1)

The self-aligned contact structure of claim 1, wherein said contact material comprises polysilicon.

### Claim 6 (depends on 1)

The self-aligned contact structure of claim 1, wherein said undercut regions have a height of from approximately 200 to approximately 1000 Angstroms (Δ).

### Claim 7 (depends on 1)

The self-aligned contact structure of claim 1, wherein said undercut regions have a height of from approximately 200 to approximately 1000 Angstroms (Δ), and a depth of from approximately 100 to approximately 300 Δ.

### Claim 8

An integrated circuit having a substrate, said integrated circuit comprising:
first and second wordline stacks disposed upon said substrate, said wordline stacks having respective sidewalls;
a first spacer layer of insulative material disposed upon said sidewalls and overlying a portion of said substrate;
a second spacer layer of insulative material disposed upon said first spacer layer and over said sidewalls, said second spacer layer being spaced a predetermined distance from said substrate, undercut regions defined by said first and second spacer layers and said substrate; and
contact material disposed upon said substrate and said second spacer layers, said contact material substantially completely filling in said undercut regions.

### Claim 9 (depends on 8)

The self-aligned contact structure of claim 8, wherein said first and second spacer layers comprise silicon nitride.

### Claim 10 (depends on 9)

The self-aligned contact structure of claim 9, wherein said first and second spacer layers have an average thickness of from approximately 200 to approximately 1000 Angstroms (Δ).

### Claim 11 (depends on 10)

The self-aligned contact structure of claim 10, wherein said first and second spacer layers have an average thickness of from approximately 200 to approximately 600 Angstroms (Δ).

### Claim 12 (depends on 8)

The self-aligned contact structure of claim 8, wherein said contact material comprises polysilicon.

### Claim 13 (depends on 8)

The self-aligned contact structure of claim 8, wherein said undercut regions have a height of from approximately 200 to approximately 1000 Angstroms (Δ).

### Claim 14 (depends on 8)

The self-aligned contact structure of claim 8, wherein said undercut regions have a height of from approximately 200 to approximately 1000 Angstroms (Δ), and a depth of from approximately 100 to approximately 300 Δ.