Semiconductor devices and their peripheral termination
AssigneeKoninklijke Philips Electronics N.V.
InventorsRob Van Dalen, Christelle Rochefort, Godefridus A. M. Hurkx
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AssigneeKoninklijke Philips Electronics N.V.
InventorsRob Van Dalen, Christelle Rochefort, Godefridus A. M. Hurkx
Estimating the term…
A semiconductor device, such as a power MOSFET, Schottky rectifier or p-n rectifier, has a voltage-sustaining zone (20) between a first (21, 23, 31a) and second (22) device regions adjacent to respective first and second opposite surfaces (11, 12) of a semiconductor body 10. Trenched field-shaping regions (40) including a resistive path (42) extend through the voltage-sustaining zone (20) to the underlying second region (22), so as to enhance the breakdown voltage of the device. The voltage-sustaining zone (20) and the trenched field-shaping regions (40) are present in both the active device area (A) and in the peripheral area (P) of the device. A further resistive path (53) extends across the first surface (11), outwardly over the peripheral area (P). This further resistive path (53) provides a potential divider that is connected to the respective resistive paths (42) of successive underlying trenched field-shaping regions (40) in the peripheral area (P). Thereby a gradual variation is achieved in the potential (V2) applied by the successive trenched field-shaping regions (40) in the peripheral area (P) of the voltage-sustaining zone (20). This advantageous peripheral termination reduces device susceptibility to deviations in the field profile in this peripheral area (P).
A semiconductor device comprising a semiconductor body that includes a voltage-sustaining zone between first and second device regions adjacent to respective first and second opposite surfaces of the body, the device regions having respective electrode connections, and trenched field-shaping regions including a resistive path that extends in trenches through the voltage-sustaining zone to the second device region, the trenches extending into the body from the first surface, the voltage-sustaining zone being so dimensioned and doped between the trenched field-shaping regions as to be depleted of free charge carriers between the trenched field-shaping regions in a voltage-blocking mode of operation, characterised in that the voltage-sustaining zone and the trenched field-shaping regions are present in both an active device area between the first and second device regions and in a peripheral area that extends around the periphery of the active area, and in that a further resistive path extends across the first surface, outwardly over the peripheral area to provide a potential divider that is connected respectively to successive underlying trenched field-shaping regions in the peripheral area thereby grading the potential applied by the successive trenched field-shaping regions in the peripheral area of the voltage-sustaining zone.
Dependencies are inferred from the claim text.