Laser cutting apparatus and method
AssigneeSamsung Electronics Co., Ltd.
InventorsDae-ho Choo, Byeong-ill Kim, Sung-uk Jung, Woo-shik Lee, Bum-soo Kim
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Abstract
The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.
Claims24
A laser cutter comprising:
- a first laser unit for irradiating a first laser beam with a first wavelength along a marked cutting line of an object being cut;
- means for cooling the marked cutting line which said first laser beam has been irradiated, and thereby to generating crack at the cooled cutting line;
- a second laser unit for irradiating a second laser beam with a second wavelength onto said crack of said object being cut;
- means for detecting said second laser beam reflected by said crack;
- and
- control means for outputting a signal for correcting traveling path of said first laser beam by comparing a real cutting path obtained by said detecting means with said marked cutting line and determining whether said real cutting path deviates from said marked cutting line.
A method for cutting a brittle object using a laser cutter, the method comprising the steps of:
- detecting a marked cutting line of said object and start edge of said marked cutting line;
- forming a pre-cut groove having a selected length and selected depth at the start edge of said marked cutting line;
- irradiating a laser beam along said marked cutting line, starting from said pre-cut groove;
- and
- rapidly cooling said marked cutting line.
A method for cutting a brittle object using a laser cutter, comprising the steps of:
- irradiating a laser beam along a marked cutting line;
- cooling said marked cutting line;
- perceiving a real cutting line from crack generated during said cooling step;
- determining whether said real cutting line deviates from said marked cutting line by comparing said real cutting line with said marked cutting line;
- and
- correcting moving path of said laser beam from result of said determining step.
Dependencies are inferred from the claim text.