# US 6,723,926 B2 · Mounting configuration of electric and/or electronic components on a printed circuit board

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- Number: US 6,723,926 B2
- Document ID: US6723926B2
- Status: Granted
- Kind: B2
- Application number: 10/134,929
- Filed: 2002-04-29
- Published: 2002-10-31
- Granted: 2004-04-20
- Earliest claimed: 2001-04-27
- Assignees: Siemens Aktiengesellschaft
- Inventors: Kurt Gross; Volker Karrer; Michael Kirchberger; Stefan Kulig; Gunter Ludwig; Hans Rappl
- Web page: https://patentgrep.com/patent/US6723926B2

## CPC

- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H02K 11/33: Drive circuits, e.g. power electronics (H02K11/38 takes precedence)
- H05K 3/202: {using self-supporting metal foil pattern}
- H05K 1/0298: {Multilayer circuits}
- H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 3/326: {the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits (H05K3/365 takes precedence)}
- H05K 3/3447: Lead-in-hole components
- H05K 2201/0397: Tab
- H05K 2201/10015: Non-printed capacitor
- H05K 2203/168: Wrong mounting prevention
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53})

## Abstract

A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.

## Claims

### Claim 1

A mounting configuration, comprising:
components each including a first connecting pin being a soldering pin having a given length and a second connecting pin being a soldering pin having a length longer than said given length and said second soldering pin having an insulating sleeve with a predetermined diameter; and
a printed circuit board having:
an insulating layer with holes formed therein for allowing said second connecting pin to pass through said insulating layer; and
a first metallic plate and a second metallic plate both having holes of a given diameter formed therein and holes of a diameter larger than said given diameter formed therein, said holes of said diameter larger than said given diameter accepting said insulating sleeve of said predetermined diameter, said first and second metallic plates electrically insulated from one another by said insulating layer, said first connecting pin being plugged and connected to said first metallic plate in said holes of said given diameter, said second connecting pin being plugged and connected to said second metallic plate in said holes of said given diameter, each of said holes of said given diameter in one of said first and second plates being aligned with a respective one of said holes of a diameter larger than said given diameter in the other of said plates, and said holes of said diameter larger than said given diameter not being connected to said first and second connecting pins, permitting only said first connecting pin to be connected with said first metallic plate and said second connecting pin to be connected with said second metallic plate.

### Claim 2 (depends on 1)

The mounting configuration according to claim 1, wherein said printed circuit board has a further insulating layer and a further metallic plate for cooling disposed next to said further insulating layer, said further insulating layer disposed adjacent said second metallic plate which is remote from a side on which said components are disposed.

### Claim 3 (depends on 1)

The mounting configuration according to claim 1, wherein said insulating layer is formed by a double-sided adhesive film.

### Claim 4 (depends on 1)

The mounting configuration according to claim 1, wherein said insulating sleeve is disposed on an end of said second connecting pin facing an associated one of said components.

### Claim 5 (depends on 1)

The mounting configuration according to claim 1, wherein said components are selected from the group consisting of electrical components and electronic components.

### Claim 6 (depends on 1)

The mounting configuration according to claim 1, wherein said components are electrolytic capacitors.

### Claim 7 (depends on 1)

The mounting configuration according to claim 1, wherein said insulating layer conducts heat.