Polyphenol resin, process for its production, epoxy resin composition and its use
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsYasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
Life of this patent
Estimating the term…
Abstract
An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.
Claims1
A method for producing a polyphenol resin having a weight-average molecular weight of 3,000 or more as determined by GPC, comprising reacting to condense a polyphenol compound represented by formula (1′)
- wherein, n′ is an average degree of polymerization as specified by the average molecular weight, and having a weight-average molecular weight of 1,500 or less as determined by GPC with a biphenyl compound represented by formula (2)
- wherein, X is a halogen, a C1-3 alkoxy group or hydroxyl group, in an amount of 0.01 mol or more and less than 0.5 mol relative to 1 equivalent of the phenolic hydroxyl group of said polyphenol compound.
Dependencies are inferred from the claim text.