Novolac polymer planarization films with high temperature stability
AssigneeHoneywell International Inc.
InventorsNigel Hacker, Todd Krajewski, Richard Spear
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Abstract
A process for forming a planarization film on a substrate that does not smoke or fume on heating includes applying a polymeric solution including a novolac resin having a weight average molecular weight between about 1000 and 3000 amu, which has been fractionated to remove molecules with molecular weight below about 350 amu, a surfactant selected from a group consisting of a non-fluorinated hydrocarbon, a fluorinated hydrocarbon and combinations thereof, and an optional organic solvent to a substrate, followed by heating the substrate.
Claims17
A polymeric solution comprising a planarizing novolac resin having a weight average molecular weight between about 1000 and 3000 amu;
- and
- a surfactant,
- wherein the planarizing novolac resin is fractionated to remove the molecules with molecular weight below about 350 amu, and
- wherein the polydispersity of the planarizing novolac resin is less than about 1.6.
Dependencies are inferred from the claim text.