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US 6,723,629 B2Granted
Method and apparatus for attaching solder members to a substrate
AssigneeTexas Instruments Incorporated
InventorsGregory B. Hotchkiss, Gary D. Stevens
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Abstract
The invention discloses a method for attaching solder members (114) to a substrate (112). The method includes forming a decal (110) with a plurality of solder members (114). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder members (114) on the decal (110) to the substrate (112).
Claims10
A method for attaching solder members to a substrate comprising the steps of:
- providing a adhesive film capable of losing adhesiveness when exposed to ultraviolet light;
- placing a photomask adjacent said film to expose a plurality of areas of said film and shield other areas of said film;
- applying ultraviolet light to the exposed areas of the film;
- then placing a plurality of solder members on the film and allowing the solder members to adhere to the shielded areas of the film;
- then aligning the film with a first substrate;
- and
- then transferring the solder members on the film to the first substrate.
4 more elements
Dependencies are inferred from the claim text.