Pressure sensitive adhesive sheet for semiconductor wafer processing
AssigneeLintec Corporation
InventorsKoichi Nagamoto, Kazuyoshi Ebe
Life of this patent
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Abstract
Disclosed herein is a pressure sensitive adhesive sheet for fixing a semiconductor wafer during semiconductor wafer processing in vacuum, comprising a substrate and, superimposed on one side or both sides thereof, a layer of ultraviolet curable pressure sensitive adhesive composition comprising an ultraviolet curable copolymer having ultraviolet polymerizable groups as side chains and a phosphorous photopolymerization initiator. The pressure sensitive adhesive sheet for semiconductor wafer processing, even in the processing of a semiconductor wafer in vacuum, is free from generating gases from the pressure sensitive adhesive sheet, thereby avoiding wafer deformation attributed to evaporated gas components and adhesive transfer caused thereby.
Claims8
A method for processing a semiconductor wafer comprising:
- adhering a first surface of the semiconductor wafer to a pressure sensitive adhesive sheet comprising a substrate, and superimposed on at least one side thereof, a layer of ultraviolet curable pressure sensitive adhesive composition comprising an ultraviolet curable copolymer having ultraviolet polymerizable groups as side chains and a phosphorous photopolymerization initiator, and
- processing a second surface of the semiconductor wafer in a vacuum while fixing and protecting the first surface of the semiconductor wafer.
Dependencies are inferred from the claim text.