Methods of making microelectronic assemblies including compliant interfaces

A method of making a microelectronic assembly comprising:

• providing a first support structure having a first surface and a second surface, said first support structure including a plurality of terminals exposed at the second surface of said first support structure;
• juxtaposing a second support structure having a first surface with said first support structure so that the first surface of said second support structure faces the first surface of said first support structure, the first surface of said second support structure including an indentation facing toward the first surface of said first support structure;
• providing a plurality of compliant pads in contact with the first surface of said first support structure and the first surface of said second support structure, said compliant pads defining channels therebetween;
• and
• disposing a compliant filler in the channels between said compliant pads.