Method of manufacturing a semiconductor device using a mold

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) providing a substrate having a main surface, a rear surface opposed to the main surface, wirings formed on the main surface, and a plurality of semiconductor device forming areas arranged on each of the main and rear surfaces thereof;
• (b) providing a plurality of semiconductor chips each having a main surface, a rear surface opposed to the main surface, and electrodes formed on the main surface;
• (c) mounting the plurality of semiconductor chips on the plurality of semiconductor device forming areas on the main surface of the substrate, respectively;
• (d) after the step (c), electrically connecting electrodes of the plurality of semiconductor chips with the wirings of the substrate by wires;
• (e) providing a mold having an upper mold half, a lower mold half and a cavity formed in the upper mold half;
• (f) after the step (d), setting the substrate with the plurality of semiconductor chips mounted thereon into a mold so that the rear surface of the substrate faces the lower mold half and so that the plurality of semiconductor chips are received into the cavity;
• (g) after the step (f), sealing the plurality of semiconductor chips with resin in block to form a seal member by injecting the resin into the cavity while allowing the rear surface of the substrate to be vacuum-chucked to the lower mold half of the mold;
• and
• (h) cutting the substrate and the seal member into individual semiconductor devices,
• wherein the substrate has conductor patterns that are electrically isolated from the plurality of semiconductor chips and arranged on the semiconductor device forming areas, and
• wherein the plurality of semiconductor chips are arranged so as to overlap the conductor patterns of the substrate in plan view.

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) providing a substrate having a main surface, a rear surface opposed to the main surface, wirings formed on the main surface, and a plurality of semiconductor device forming areas arranged on each of the main and rear surfaces thereof;
• (b) providing a plurality of semiconductor chips each having a main surface, a rear surface opposed to the main surface, and electrodes formed on the main surface;
• (c) mounting the plurality of semiconductor chips on the plurality of semiconductor device forming areas on the main surface of the substrate, respectively;
• (d) after the step (c), electrically connecting electrodes of the plurality of semiconductor chips with the wirings of the substrate by wires;
• (e) providing a mold having an upper mold half, a lower mold half and a cavity formed in the upper mold half;
• (f) after the step (d), setting the substrate with the plurality of semiconductor chips mounted thereon into a mold so that the rear surface of the substrate faces the lower mold half and so that the plurality of semiconductor chips are received into the cavity;
• (g) after the step (f), sealing the plurality of semiconductor chips with resin in block to form a seal member by injecting the resin into the cavity while allowing the rear surface of the substrate to be vacuum-chucked to the lower mold half of the mold;
• and
• (h) cutting the substrate and the seal member into individual semiconductor devices,
• wherein the substrate has reinforcing conductor patterns arranged at the outside of the semiconductor device forming areas.

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) providing a substrate having a main surface, a rear surface opposed to the main surface, wirings formed on the main surface, and a plurality of semiconductor device forming areas arranged on each of the main and rear surfaces thereof;
• (b) providing a plurality of semiconductor chips each having a main surface, a rear surface opposed to the main surface, and electrodes formed on the main surface;
• (c) mounting the plurality of semiconductor chips on the plurality of semiconductor device forming areas on the main surface of the substrate, respectively;
• (d) after the step (c), electrically connecting electrodes of the plurality of semiconductor chips with the wirings of the substrate by wires;
• (e) providing a mold having an upper mold half, a lower mold half and a cavity formed in the upper mold half;
• (f) after the step (d), setting the substrate with the plurality of semiconductor chips mounted thereon into a mold so that the rear surface of the substrate faces the lower mold half and so that the plurality of semiconductor chips are received into the cavity;
• (g) after the step (f), sealing the plurality of semiconductor chips with resin in block to form a seal member by injecting the resin into the cavity while allowing the rear surface of the substrate to be vacuum-chucked to the lower mold half of the mold;
• and
• (h) cutting the substrate and the seal member into individual semiconductor devices,
• wherein the substrate has conductor patterns that are electrically isolated from the plurality of semiconductor chips and arranged at the outside of the semiconductor device forming areas.