# US 6,723,582 B2 · Method of making a semiconductor package having exposed metal strap

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- Number: US 6,723,582 B2
- Document ID: US6723582B2
- Status: Granted
- Kind: B2
- Application number: 10/356,046
- Filed: 2003-01-31
- Published: 2003-06-19
- Granted: 2004-04-20
- Earliest claimed: 2000-12-07
- Assignees: Amkor Technology, Inc.
- Inventors: Thomas P. Glenn; Blake A. Gillett
- Web page: https://patentgrep.com/patent/US6723582B2

## CPC

- H10W 70/466: {Tape carriers or flat leads}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 72/075: {of bond wires}
- H10W 72/07636: {Soldering or alloying}
- H10W 72/07637: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/07653: {changes in shapes}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/551: {Materials of bond wires}
- H10W 72/631: {Shapes of strap connectors}
- H10W 72/652: {comprising metals or metalloids, e.g. silver}
- H10W 72/871: {Bond wires and strap connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/951: {Materials of bond pads}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. The die and at least portions of the strap and substrate are encapsulated in an insulative encapsulant, such as molded plastic. A top surface of the strap is exposed to the environment through the encapsulant. The exposed surface may have grooves formed therein, or fins formed thereon, to facilitate heat transfer.

## Claims

### Claim 1

A method for making a semiconductor device, the method comprising:
providing a substrate having at least coplanar first and second portions each including one or more leads, each said portion being electrically isolated from each other said portion;
providing a semiconductor die having a first terminal electrically connected to a first conductive layer on a first surface of the die, and a second terminal electrically connected to a second conductive layer on an opposite second surface of the die;
providing a metal strap having a cover portion at a first end thereof and an opposite second end, wherein said cover portion has a first surface and an opposite second surface;
mounting the die on the substrate so that the first surface of the die faces the first portion of the substrate;
attaching both the first conductive layer to the first portion of the substrate and the second end portion of the strap to the second portion of the substrate with an electrically conductive material;
attaching the second conductive layer of the die to the first surface of the cover portion of the strap with an electrically and thermally conductive material;
encapsulating the semiconductor die, at least a portion of the substrate, and the metal strap in a body of nonconductive material, while leaving the second surface of the cover portion of the strap exposed.

### Claim 2 (depends on 1)

The method of claim 1, wherein the die has a third terminal, and a third conductive layer on the second surface of the die that is electrically connected to the third terminal and electrically isolated from the second conductive layer, and the substrate has a third portion including at least one lead, said third portion being coplanar with the first and second portions but electrically isolated therefrom, and
further comprising electrically connecting a wire between the third portion of the substrate and the third conductive layer.

### Claim 3 (depends on 1)

The method of claim 1, wherein the die has a third terminal, and a third conductive layer on the first surface of the die that is electrically connected to the third terminal and electrically isolated from the first conductive layer, and the substrate has a third portion including at least one lead, said third portion being coplanar with the first and second portions but electrically isolated therefrom, and further comprising juxtaposing and attaching the third conductive layer to the third portion of the substrate with an electrically conductive material.

### Claim 4 (depends on 1)

The method of claim 1, wherein the metal strap has one or more recesses in the second surface of the cover portion that are not covered during said encapsulating step.

### Claim 5 (depends on 1)

The method of claim 1, wherein the metal strap has one ore more vertical protrusions that extend from the second surface of the cover portion and are not covered during said encapsulating step.

### Claim 6

A method of making a semiconductor device, comprising:
providing a substrate having a plurality of leads and a die mounting region;
providing a semiconductor die having a plurality of conductive bond pads on an active first surface thereof and an opposite inactive second surface, wherein the second surface is mounted on the die mounting region;
providing a plurality of electrical conductors, and electrically connecting each conductor between a lead and a bond pad on the first surface of the die;
providing a metal strap having a cover portion at a first end thereof and an opposite second end portion, the cover portion having a first surface and an opposite second surface;
attaching the first surface of the cover portion of the strap to the first surface of the die with a thermally conductive nonelectrically conductive first material, and attaching the second end portion of the strap to one or more leads with a thermally conductive second material; and,
forming a body of nonconductive encapsulant material over the semiconductor die and at least a portion of the substrate, wherein the second surface of the cover portion of the strap is exposed through the encapsulant material.

### Claim 7 (depends on 6)

The method of claim 6, wherein the metal strap has one or more recesses in the second surface of the cover portion that are not covered by said encapsulant material.

### Claim 8 (depends on 6)

The method of claim 6, wherein the metal strap has one or more vertical protrusions that extend from the second surface of the cover portion and are not covered by said encapsulant material.

### Claim 9

A method of making a semiconductor device, comprising:
providing a metal leadframe comprising a plurality of leads;
providing a semiconductor die, wherein the semiconductor die is electrically coupled to at least one of the leads by a metal strap;
encapsulating the semiconductor die, the metal strap, and the leadframe in a body of a plastic encapsulant material, wherein at least a portion of the leads and a portion of the metal strap are exposed outside of the body of plastic encapsulant material.

### Claim 10 (depends on 9)

The method of claim 9, wherein a surface of the strap exposed through the body of the plastic encapsulant material includes protrusions or grooves.