# US 6,721,189 B1 · Memory module

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- Number: US 6,721,189 B1
- Document ID: US6721189B1
- Status: Granted
- Kind: B1
- Application number: 10/098,520
- Filed: 2002-03-13
- Granted: 2004-04-13
- Earliest claimed: 2002-03-13
- Assignees: Rambus Inc.
- Inventors: Belgacem Haba
- Web page: https://patentgrep.com/patent/US6721189B1

## CPC

- H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)}
- H01R 12/52: connecting to other rigid printed circuits or like structures
- H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit}
- H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
- H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/325: by abutting or pinching; Mechanical auxiliary parts therefor
- H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers}
- H05K 2201/10159: Memory
- H05K 2201/10378: Interposers
- H05K 2201/10719: Land grid array [LGA]
- H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector electrically couples the first circuit board to the second circuit board, such that the memory chip is electrically connected to the array of electrical contact points. Alternatively, the memory module that rigid/flex circuit board. The rigid/flex circuit board includes a substantially rigid first section having at least one memory chip disposed thereon, and a substantially rigid second section having an array of electrical contact points disposed on a planar surface thereof. The rigid/flex circuit board also includes a flexible third section in-between the first section to the second section.

## Claims

### Claim 1

A memory module, comprising:
a substantially rigid first circuit board having at least one memory chip disposed thereon; and
a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof;
a flexible connector electrically configured to couple said first circuit board to said second circuit board, such that said memory chip is electrically connected to said array of electrical contact points,
wherein said array of electrical contact points is configured and dimensioned to removably and electrically engage with an intermediary device, which itself is configured and dimensioned to removably electrically engage with an additional array of electrical contact points on a target circuit board.

### Claim 2 (depends on 1)

The memory module of claim 1 wherein said first circuit board is configured substantially perpendicular to said second circuit board.

### Claim 3 (depends on 1)

The memory module of claim 1 wherein said first circuit board and said second circuit board are connected to a bracket.

### Claim 4 (depends on 1)

The memory module of claim 1 wherein memory chips are attached to both planar surfaces of said first circuit board.

### Claim 5 (depends on 1)

The memory module of claim 1, wherein said intermediary device is a land grid array socket
comprising a flat substrate with protruding structures on at least one side thereof, said protruding structures configured and dimensioned to ensure electrical contact between said array of electrical contact points and said additional array of electrical contact points.

### Claim 6 (depends on 5)

The memory module of claim 5, wherein said at least one protruding structure is resilient along a line joining respective contacts of said array of electrical contacts and said additional array of electrical contacts.

### Claim 7 (depends on 5)

The memory module of claim 5, wherein each said at least one protruding structure is a single “C” shaped resilient metal insert.

### Claim 8 (depends on 1)

The memory module of claim 1, wherein said flexible connector comprises one or more electrical wires.

### Claim 9 (depends on 1)

The memory module of claim 1, wherein said flexible connector comprises one or more flexible circuit boards.

### Claim 10 (depends on 1)

The memory module of claim 1, wherein said first and second circuit boards comprise substantially rigid sections of a rigid/flex circuit board and said flexible connector comprises the flexible part of the rigid/flex circuit board.

### Claim 11 (depends on 1)

The memory module of claim 1, further comprising functional electrical elements coupled to said first circuit board.

### Claim 12 (depends on 1)

The memory module of claim 1, wherein said array of electrical contacts and said additional array of electrical contacts comprise a matrix of columns and rows of electrical contacts.

### Claim 13

A memory module, comprising:
a single rigid/flex circuit board comprising:
a substantially rigid first section having at least one memory chip disposed thereon;
a substantially rigid second section having an array of electrical contact points disposed on a planar surface thereof; and
a flexible third section in between said first section to said second section.

### Claim 14 (depends on 13)

The memory module of claim 13 wherein said first circuit board is configured substantially perpendicular to said second circuit board.

### Claim 15 (depends on 13)

The memory module of claim 13 wherein said first circuit board and said second circuit board are connected to a bracket.

### Claim 16 (depends on 13)

The memory module of claim 13 wherein memory chips are attached to both planar surfaces of said first circuit board.

### Claim 17 (depends on 13)

The memory module of claim 13, wherein said electrical contact points are configured to electrically engage with a land grid array socket that is in turn configured to electrically engage with an additional array of electrical contact points on a target circuit board,
such that in use said array of electrical contact points on said second circuit board electrically connect with said additional array of electrical contact points on said target board.

### Claim 18 (depends on 13)

The memory module of claim 13, wherein said flexible third section includes a reinforcing material applied thereto.

### Claim 19

A method for using a memory module comprising:
providing a substantially rigid first circuit board having at least one memory chip disposed thereon;
providing a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof; and
electrically coupling said first circuit board to said second circuit board via a flexible connector;
removably electrically connecting said array of electrical contact points to an intermediary device; and
removably electrically connecting said intermediary device to a target board.

### Claim 20 (depends on 19)

The method of claim 19, wherein said intermediary device is a land grid array socket comprising a flat substrate with protruding structures on at least one side therof, said protruding structures configured and dimensioned to ensure electrical contact between said array of electrical contact points and an additional array of electrical contact points on said target board.