# US 6,721,187 B2 · Multi-layered high density connections

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- Number: US 6,721,187 B2
- Document ID: US6721187B2
- Status: Granted
- Kind: B2
- Application number: 09/811,101
- Filed: 2001-03-16
- Published: 2002-09-19
- Granted: 2004-04-13
- Earliest claimed: 2001-03-16
- Assignees: International Business Machines Corporation
- Inventors: Richard Ronald Hall; How Tzu Lin; Christopher John Majka; Norman Corey Seastrand; Matthew Francis Seward; Ronald Verne Smith
- Web page: https://patentgrep.com/patent/US6721187B2

## CPC

- H05K 3/403: {Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)}
- H01R 12/52: connecting to other rigid printed circuits or like structures
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions}
- H05K 3/3405: {Edge mounted components, e.g. terminals}
- H05K 3/4611: {by laminating two or more circuit boards (H05K3/4652 takes precedence)}
- H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets}
- H05K 2201/0919: Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
- H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane
- H05K 2201/10446: Mounted on an edge
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.

## Claims

### Claim 1

An electronic sub assembly comprising a circuitized laminated substrate having top and bottom surfaces, and at least one beveled edge surface between said top and bottom surfaces, at least one active or passive device mounted on said at least one beveled edge surface, at least one other active or passive device mounted on at least one of the top and bottom surfaces, a conductive lead embedded in the substrate electrically connected to the active or passive device mounted on said at least one edge surface, the conductive lead also electrically connected to the at least one other active or passive device on the top or bottom surface.

### Claim 2 (depends on 1)

The sub assembly according to claim 1 wherein each of the active or passive devices is selected from the group including chips, diodes, resistors, capacitors and printed wiring boards.

### Claim 3 (depends on 1)

The sub assembly according to claim 1 further including an electrically conductive via extending into the substrate from each device on the top or bottom surface into contact with a conductive lead connected to an edge mounted device.

### Claim 4 (depends on 1)

The sub assembly according to claim 1 wherein the laminated substrate is selected from the group comprising a single or multiple laminates of a fiberglass reinforced prepreg and a conductive layer, and a single or multiple laminates of a ceramic module and a conductive layer.

### Claim 5 (depends on 1)

The electronic sub assembly according to claim 1 wherein the edge surface is beveled at an angle of between 30° and 60° with respect to the top or bottom surface.

### Claim 6

A printed circuit board having two spaced apart, generally parallel surfaces comprising a top surface and a bottom surface, a beveled edge surface between said top and bottom surfaces, a plurality of conductive leads embedded in the circuit board parallel to the top and bottom surfaces and terminating in one or more connection points along the beveled edge surface, an active or passive device mounted on said edge surface and electrically joined through at least one of said connection points to at least one of the conductive leads, and at least one other active or passive device mounted on the top or bottom surface electrically joined through one of said conductive leads to the edge mounted device.

### Claim 7 (depends on 6)

The printed circuit board according to claim 6 further including a via on the top or bottom surface, and coupled to a top or bottom mounted device, said via extending into the substrate into contact with a conductive lead connected to said edge mounted device.

### Claim 8 (depends on 6)

The printed circuit board according to claim 6 wherein each active or passive device is selected from the group including chips, diodes, resistors, capacitors and printed wiring boards.

### Claim 9 (depends on 6)

The printed circuit board according to claim 6 wherein the edge surface is beveled at an angle of between 30° and 60° with respect to the top or bottom surface.