BOC BGA package for die with I-shaped bond pad layout
AssigneeMicron Technology, Inc.
InventorsThiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
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Abstract
Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
Claims53
A semiconductor assembly, comprising:
- a semiconductor die having a first surface, a second surface, and sides;
- the first surface having a plurality of bond pads disposed thereon in an I-shaped layout;
- and
- a support substrate having a first side, a second side, and an I-shaped opening corresponding to the layout of the bond pads, a plurality of bond pad fingers disposed on the first side of the support substrate and adjacent to the opening;
- the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers.
A semiconductor package, comprising:
- a semiconductor die mounted on a support substrate;
- the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
- the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
- the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers;
- and the bond pads on the die covered by a molding compound.
A semiconductor package, comprising:
- a semiconductor die mounted on a support substrate;
- the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
- the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
- the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers;
- and the bond pads and the sides of the die are covered by the molding compound, and the second surface of the die is uncovered.
A semiconductor package, comprising:
- a semiconductor die mounted on a support substrate;
- the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
- the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
- the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers;
- and the bond pads, the sides and the second surface of the die are covered by the molding compound.
A semiconductor package, comprising:
- a semiconductor die mounted on a support substrate;
- the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
- the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
- the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers, and a gap between a peripheral edge of the die and the opening of the support substrate;
- and the bond pads on the die covered by a molding compound.
A semiconductor package, comprising:
- a semiconductor die mounted on a support substrate;
- the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
- the support substrate having a first side, a second side, an I-shaped opening, a hole adjacent the opening through the substrate, and a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
- the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers, and the hole providing a passage through the support substrate;
- and the bond pads on the die covered by a molding compound.
A semiconductor package, comprising:
- a semiconductor die mounted on a support substrate;
- the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
- the support substrate having a first side, a second side, an I-shaped opening, a hole adjacent the opening through the substrate, and a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
- the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers, the hole providing a passage through the support substrate;
- and a gap between a peripheral edge of the die and the opening of the support substrate;
- and the bond pads on the die covered by a molding compound.
A die assembly, comprising:
- a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening.
A die assembly, comprising:
- a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening, and an adhesive layer disposed between the die and the support substrate, the adhesive layer comprising an I-shaped opening corresponding to the I-shaped opening of the support substrate.
A die assembly, comprising:
- a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening, and adhesive strips disposed between the die and the support substrate on opposite sides of the I-shaped opening.
A die assembly, comprising:
- a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening with the bond pads exposed through the I-shaped opening and a gap between a peripheral edge of the die and the opening of the support substrate.
A die assembly, comprising:
- a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, and a support substrate having an I-shaped opening and a hole through the substrate adjacent the opening, the die mounted on the support substrate with the bond pads exposed through the I-shaped opening, a gap between a peripheral edge of the die and the opening of the support substrate, and the hole uncovered.
A die assembly, comprising:
- a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening;
- and
- means for mounting the die onto the support substrate.
An external electronic component electrically connected to a die assembly, the die assembly being at least partially encapsulated and comprising a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening.
An external electronic component electrically connected to a die assembly, the die assembly being at least partially encapsulated and comprising a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening, with an adhesive layer disposed between the die and the support substrate, the adhesive layer comprising an I-shaped opening corresponding to the I-shaped opening of the support substrate.
An external electronic component electrically connected to a die assembly, the die assembly being at least partially encapsulated and comprising a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening, with adhesive strips disposed between the die and the support substrate on opposite sides of the I-shaped opening.
An external electronic component electrically connected to a die assembly, the die assembly being at least partially encapsulated and comprising a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening such the bond pads are exposed through the I-shaped opening and a gap between a peripheral edge of the die and the opening of the support substrate.
An external electronic component electrically connected to a die assembly, the die assembly being at least partially encapsulated and comprising a semiconductor die comprising bond pads disposed thereon in an I-shaped layout, the die mounted on a support substrate having an I-shaped opening and a hole through the substrate adjacent the opening, with the bond pads exposed through the I-shaped opening, a gap between a peripheral edge of the die and the opening of the support substrate, and the hole uncovered.
Dependencies are inferred from the claim text.