Enhanced pad design for substrate
AssigneeInternational Business Machines Corporation
InventorsJohn Joseph Garrity, John James Hannah McMorran
Life of this patent
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Abstract
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.
Claims6
An electronic assembly comprising:
- a substrate including a plurality of contacts thereon;
- a plastic ball grid array electronic package including a plurality of round contacts thereon;
- a plurality of round solder balls, each of said round solder balls being adapted for electrically coupling one of said plurality of contacts on said substrate to a respective one of said plurality of round contacts of said plastic ball grid array electronic package;
- and
- a first joining medium electrically connecting each of said round solder balls to respective ones of said plurality of contacts of said substrate, said contacts of said substrate each being of a substantially square shape having corners such that each corner projects exterior to the respective solder ball and having sides such that a portion of each side projects interior to the respective solder ball.
Dependencies are inferred from the claim text.