Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument

A semiconductor device comprising:

• a semiconductor element having through holes formed therein and electrodes formed on a first surface of the semiconductor element, the electrodes having penetrating holes formed therein, each of the through holes overlapping with one of the penetrating holes;
• and
• conductive layers which are electrically connected to the electrodes, each of the conductive layers provided from the first surface through inner walls of one of the through holes and one of the penetrating holes to a second surface of the semiconductor element which is opposite to the first surface,
• the conductive layers including connecting portions so that a distance between two of the connecting portions is different from a distance between two of the electrodes, the connecting portions formed on at least one of the first and second surfaces.