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US 6,720,659 B1Granted
Semiconductor device having an adhesion layer
AssigneeTokyo Electron Limited
InventorTakashi Akahori
Life of this patent
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Abstract
Insulating films 21 through 24 of CF films (fluorine-contained carbon films) are formed on a substrate (not shown). In addition, Cu wiring layers 25 and 26 are formed on the CF films 21 and 23 via an adhesion layer 29 which comprises a Ti layer and a TiC layer. By forming the insulating films 21 through 24 of CF films, Cu in the wiring layers is prevented from diffusing into the insulating films 21 through 24. The relative dielectric constant of the CF film is smaller than the relative dielectric constant of a BCB film.
Claims7
A semiconductor device comprising:
- a substrate;
- an insulating film of a fluorine-contained carbon film formed on said substrate, wherein the surface of said insulating film is irradiated with hydrogen plasma;
- a wiring layer of copper formed on said insulating film;
- and an adhesion layer formed between said Insulating film and said wiring layer, for preventing said wiring layer from being peeled off from said insulating film, wherein said adhesion layer includes
- a metal layer of a metal disposed adjacent said wiring layer, and
- a layer of a compound containing carbon and said metal disposed adjacent said insulating film.
3 more elements
Dependencies are inferred from the claim text.