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US 6,720,658 B2Granted
Semiconductor device having a plurality of conductive layers
AssigneeKabushiki Kaisha Toshiba
InventorMinakshisundaran Balasubramanian Anand
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Abstract
In the present invention, the bonding pad is formed in a lattice-like shape. Directly underneath the passivation layer, the etching stopper layer is provided. An opening is made through the passivation layer and the etching stopper layer so as to expose the bonding pad. The cavity sections of the lattice-like shape of the bonding pad are filled with the insulating layer. The bonding wire is connected to the lattice-shaped bonding pad. With this structure, the bonding error of the device manufactured by the damascening process can be avoided.
Claims12
A semiconductor device comprising:
- a semiconductor substrate;
- a semiconductor element formed on said semiconductor substrate;
- a first insulating layer formed above said semiconductor element and having a fiat upper surface and a plurality of pillars, first and second grooves formed therein, said first groove having a lattice pattern by said plurality of pillars, each pillar having a fiat upper surface;
- a first layer of conductive material formed in said first groove, said first layer of conductive material functioning as a bonding pad and having a flat upper surface;
- a passivation layer formed above said first insulating layer and having an opening exposing said first layer of conductive material;
- a second layer of conductive material formed in said second groove forming a wiring layer;
- and
- a second insulating layer formed between said first insulating layer and said passivation layer, said second insulating layer being of a material having a high etch selectivity compared to said passivation layer, said second insulating layer having art opening coinciding with said opening in said passivation layer,
- wherein the upper surface of said first insulating layer, said pillars, and said first layer of conductive material are coplanar.
6 more elements
Dependencies are inferred from the claim text.