Semiconductor device having heat spreader attached thereto and method of manufacturing the same
AssigneeNEC Electronics Corporation
InventorTakashi Miyazaki
Life of this patent
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Abstract
In a semiconductor device having a heat spreader attached thereto, a semiconductor chip is mounted on a multi-layer wiring substrate via an electrode pad and an insulating resin. The sides of the semiconductor chip on the substrate are sealed with the insulating resin, and a copper paste film contacted to the exposed surface of the semiconductor chips are formed. The copper paste film functions as a heat spreader.
Claims16
A semiconductor device having a heat spreader attached thereto, comprising:
- a semiconductor chip;
- and
- a copper paste film contacting a surface on which a wiring is not formed on said semiconductor chip, said copper paste film including a base portion in contact with a semiconductor wafer and individual alternately spaced portions which protrude from the base portion away from the semiconductor wafer,
- wherein said copper paste film functions as a heat spreader for spreading heat over a heat spread area;
- and
- an insulating resin for sealing the semiconductor chip on a substrate.
A semiconductor device having a heat spreader attached thereto, comprising:
- a substrate;
- a semiconductor chip mounted on the substrate;
- an insulating resin layer for sealing a side of the semiconductor chip on said substrate;
- and
- a copper paste film contacted to an exposed surface of said semiconductor chip,
- wherein said copper paste film functions as a heat spreader for spreading heat over a heat spread area and
- said copper paste film has irregularities on a surface which is not in contact with said semiconductor chip, to extend the heat spread area.
A method of manufacturing a semiconductor device having a heat spreader attached thereto, comprising the steps of:
- mounting a plurality of semiconductor chips on a substrate;
- sealing said substrate between said semiconductor chips with an insulating resin;
- and
- forming a copper paste film as a heat spreader for spreading heat over a heat spread area on an exposed surface of said semiconductor chips and on said insulating resin, said copper paste film having irregularities on a surface which is not in contact with said semiconductor chip, to extend the heat spread area.
A method of manufacturing a semiconductor device having a heat spreader attached thereto, comprising the steps of:
- forming a copper paste film as a heat spreader for spreading heat over a heat spread area on a surface of a semiconductor wafer, on which a wiring layer is not formed, said wafer having said wiring layer on an other surface thereof and a semiconductor element;
- and
- dividing said semiconductor wafer into a plurality of individual semiconductor chips, thereby, separating said copper paste film into individual copper paste films on the semiconductor chips so that said copper paste films include a base portion in contact with a semiconductor wafer and individual alternately spaced portions which protrude from said base portion away from said semiconductor wafer.
Dependencies are inferred from the claim text.