Electronic device
AssigneeMurata Manufacturing Co., Ltd.
InventorHideki Matsuda
Life of this patent
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Abstract
An electronic device includes a ceramic chip carrier having an opening, a SAW element chip housed in the opening, a Kovar sealing ring, which is bonded to the ceramic chip carrier by using an Ag brazing material or other suitable material such that the Kovar sealing ring encircles the opening, and a Kovar metal cap, which is placed on the Kovar sealing ring, wherein the Kovar metal cap is coated with Ni-plating which is used as a brazing material for seam-welding and bonding the Kovar metal cap to the Kovar sealing ring and the hermeticity between the metal cap and the sealing ring increases when the thickness of the Ni-plating is about 1 μm to about 2 μm.
Claims3
An electronic device comprising:
- a ceramic chip carrier having a recess;
- an element chip provided in the recess of the ceramic chip carrier;
- a metal sealing ring, which is bonded to the ceramic chip carrier such that the metal sealing ring surrounds an opening of the recess of said ceramic chip carrier;
- and
- a metal cap closing an opening of the metal sealing ring to hermetically seal the recess, said metal cap being coated with an Ni-plating having a thickness of about 1 μm to about 2 μm for bonding the metal cap to the metal sealing ring;
- wherein
- said Ni-plating is directly bonded to the metal sealing ring.
Dependencies are inferred from the claim text.