Semiconductor device

A semiconductor device comprising:

• a tape-form member including a first surface and a second surface;
• a semiconductor element mounted at the first surface of the tape-form member and including electrodes;
• and
• a plurality of inner leads formed at the second surface of the tape-form member and located at peripheral portions of the semiconductor element, the inner leads being electrically connected with the electrodes of the semiconductor element at the first surface of the tape-form member,
• wherein an aperture for connection of the inner leads with the electrodes of the semiconductor element is formed through the tape-form member, the inner leads extending entirely across the aperture,
• the distal end portions of the inner leads are fixed to the tape-form member, and the inner leads are electrically connected through the aperture with the electrodes of the semiconductor element, and
• the tape-form member further including a member formed on the inner leads so as to sandwich the inner leads with the base film.

A semiconductor device comprising:

• a tape-form member including a first surface and a second surface;
• a semiconductor element mounted at the first surface of the tape-form member and including electrodes;
• and
• a plurality of inner leads formed at the second surface of the tape-form member and located at peripheral portions of the semiconductor element, the inner leads being electrically connected with the electrodes of the semiconductor element at the first surface of the tape-form member,
• wherein a plurality of apertures for connection of the inner leads with the electrodes of the semiconductor element are formed through the tape-form member in one-to-one correspondence with the inner leads, each of the inner leads extending entirely across one of the apertures, and
• the distal end portions of the inner leads are fixed to the tape-form member, and the inner leads are electrically connected through the apertures with the electrodes of the semiconductor element.