Stacked semiconductor module

A semiconductor module, comprising:

• a semiconductor housing;
• a plurality of integrated circuit dies positioned within said housing, wherein at least one of said plurality of integrated circuit die does not function;
• and
• a programmable memory device positioned within said housing, where said programmable memory device is programmed to indicate identities of all functioning integrated circuit dies of said plurality of integrated circuit dies having desired characteristics, thereby enabling a controller to separately address the functioning integrated circuit dies in the semiconductor module.

A semiconductor module, comprising:

• a semiconductor housing;
• a plurality of integrated circuit dies stacked adjacent one another within said housing, wherein at least one of said plurality of integrated circuit dies does not function;
• and
• a programmable memory device positioned within said housing and electrically coupled to said plurality of integrated circuit dies, where said programmable memory device stores a maximum operating frequency of said semiconductor module, and identities of all functioning integrated circuit dies of said plurality of integrated circuit dies to enable a controller to separately address the functioning integrated circuit dies in the semiconductor module.