Semiconductor structure having backside probe points for direct signal access from active and well regions

An integrated circuit structure in a device package, comprising:

• a package substrate including a first set of bonding pads on a first surface and a second set of bonding pads on a second surface;
• a device substrate having an exposed back surface, a front surface, and a circuit interconnect layer disposed near the front surface and having a plurality of electronic components formed therein and a plurality of input/output pads connected to selected ones of the components and to respective ones of the second set of bonding pads of the package substrate;
• a transistor including source and drain regions disposed in the substrate between the interconnect layer and the back surface;
• a well region surrounding the source and drain regions;
• and
• an electrically conductive probe extending from the back surface of the device substrate to the well region and terminating at the well region, the probe including a signal-coupling tip adapted to electrically couple to the well region.

An integrated circuit structure in a device package, comprising:

• a package substrate including a first set of bonding pads on a first surface and a second set of bonding pads on a second surface;
• a device substrate having an exposed back surface, a front surface, and a circuit interconnect layer disposed near the front surface and having a plurality of electronic components formed therein and a plurality of input/output pads connected to selected ones of the components and to respective ones of the second set of bonding pads of the package substrate;
• a plurality of transistors, each including respective source and drain regions disposed in the device substrate between the interconnect layer and the back surface;
• a plurality of well regions surrounding selected respective pairs of the source and drain regions;
• and
• a plurality of electrically conductive probes extending from the back surface of the device substrate to selected respective ones of the source, drain, and well regions and terminating at the selected respective ones of the source, drain and well regions, each probe including a signal-coupling tip adapted to electrically couple to the selected region at which it terminates.

An integrated circuit structure in device package, comprising:

• a package substrate including a first set of bonding pads on a first surface and a second set of bonding pads on a second surface;
• a device substrate having an exposed back surface, a front surface, and a circuit interconnect layer disposed near the front surface and having a plurality of electronic components formed therein and a plurality of input/output pads connected to selected ones of the components and to respective ones of the second set of bonding pads of the package substrate;
• a plurality of active regions disposed in the device substrate between the interconnect layer and the back surface;
• a plurality of electrically conductive probes extending from the back surface of the device substrate to respective ones of the active regions and terminating at the respective active regions, each probe including a signal-coupling tip adapted to electrically couple to the respective active region at which it terminates;
• an electrically insulative layer disposed on the back surface of the device substrate and extending between one or more selected pairs of the probes;
• and
• one or more electrically conductive lines disposed on the insulative layer and respectively coupling the selected one or more pairs of probes.

An integrated circuit structure comprising:

• a substrate having an exposed back surface, a front surface, and a circuit interconnect layer disposed near the front surface, the interconnect layer having a plurality of electronic components formed therein;
• an active region disposed in the substrate between the interconnect layer and the back surface, the active region being at least one of:
• a source, drain or well;
• an electrically conductive probe extending from the back surface of the substrate and terminating at the active region.