Semiconductor device with a staggered pad arrangement

Abstract

A semiconductor device includes a plurality of internal row pads and external row pads, consisting of a pad and a pad-control portion that controls an input signal from and an output signal to the pad. The pad and the pad-control portion of the internal row pad are disposed in relationship of reversed arrangement with the pad and the pad-control portion of the external row pad. A plurality of the internal row pads in which the pad and the pad-control portion are disposed in the bonding direction and a plurality of the external row pads in which the pad and the pad-control portion are disposed in the bonding direction are each alternately disposed adjacent perpendicularly to the bonding direction.

Dependencies are inferred from the claim text.