Heater assembly for heating a wafer
AssigneeSamsung Electronics Co., Ltd.
InventorsGyeong-Su Keum, Hyung-Sik Hong, Chung-Hun Park, Eun-Seok Song, Jae-Han Park
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AssigneeSamsung Electronics Co., Ltd.
InventorsGyeong-Su Keum, Hyung-Sik Hong, Chung-Hun Park, Eun-Seok Song, Jae-Han Park
Estimating the term…
A heater assembly of a semiconductor device manufacturing apparatus minimizes a temperature difference between a peripheral portion and a central portion of the wafer being processed in the apparatus. The heater assembly includes a unitary resistive heating member in the form of a disc, heat blocks that divide the peripheral portion and central portion of the upper surface of the disc into respective heating sections, a support for supporting the heating member, and an electric power source for supplying electric current to the unitary heating member. The widths of the heating sections become greater towards the center of the heater, and thus the electrical resistance of the heater also increases in a direction towards the center of the heater. The power source for the heater includes a lead that extends from the bottom surface of the heater to a bottom portion of the heater support.
A heater assembly of an apparatus for heating an object, comprising:
Dependencies are inferred from the claim text.